2D and 3D Inductors Antenna and Transformers Fabricating Photoactive Substrates

ABSTRACT

A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.15/308,583 filed on Nov. 2, 2016, which is a U.S. 371 National PhaseApplication from PCT International Serial No. PCT/US2015/029222 filed onMay 5, 2015, and entitled “2D and 3D Inductors Antenna and TransformersFabricating Photoactive Substrates,” and claims benefit of U.S.Provisional Application Ser. No. 61/988,615, filed on May 5, 2014.

FIELD OF INVENTION

The present invention relates to creating an inductive current device ina photo definable glass structure, in particular, creating Inductors,Antenna, and Transformers devices and arrays in glass ceramic substratesfor electronic, microwave and radio frequency in general.

Photosensitive glass structures have been suggested for a number ofmicromachining and microfabrication processes such as integratedelectronic elements in conjunction with other elements systems orsubsystems.

Silicon microfabrication of traditional glass is expensive and low yieldwhile injection modeling or embossing processes produce inconsistentshapes. Silicon microfabrication processes rely on expensive capitalequipment; photolithography and reactive ion etching or ion beam millingtools that generally cost in excess of one million dollars each andrequire an ultra-clean, high-production silicon fabrication facilitycosting millions to billions more. Injection molding and embossing areless costly methods of producing a three dimensional shapes but generatedefects with in the transfer or have differences due to the stochasticcuring process.

SUMMARY OF INVENTION

The present invention provides creates a cost effective glass ceramicinductive individual or array device. Where glass ceramic substrate hasdemonstrated capability to form such structures through the processingof both the vertical as well as horizontal planes either separately orat the same time to form, two or three-dimensional inductive devices.

The present invention includes a method to fabricate a substrate withone or more, two or three dimensional inductive device by preparing aphotosensitive glass substrate and further coating or filling with oneor more metals.

A method of fabrication and device made by preparing a photosensitiveglass ceramic composite substrate comprising at least silica, lithiumoxide, aluminum oxide, and cerium oxide, masking a design layoutcomprising one or more, two or three dimensional inductive device in thephotosensitive glass substrate, exposing at least one portion of thephotosensitive glass substrate to an activating energy source, exposingthe photosensitive glass substrate to a heating phase of at least tenminutes above its glass transition temperature, cooling thephotosensitive glass substrate to transform at least part of the exposedglass to a crystalline material to form a glass-crystalline substrateand etching the glass-crystalline substrate with an etchant solution toform one or more angled channels or through holes that are then used inthe inductive device.

The present invention provides a method to fabricate an inductive devicecreated in or on photo-definable glass comprising the steps of:preparing a photosensitive glass substrate comprising at least silica,lithium oxide, aluminum oxide, and cerium oxide; masking a design layoutcomprising one or more structures to form one or more electricalconduction paths on the photosensitive glass substrate; exposing atleast one portion of the photosensitive glass substrate to an activatingenergy source; exposing the photosensitive glass substrate to a heatingphase of at least ten minutes above its glass transition temperature;cooling the photosensitive glass substrate to transform at least part ofthe exposed glass to a crystalline material to form a glass-crystallinesubstrate; etching the glass-crystalline substrate with an etchantsolution to form the one or more angled channels in the device; whereinthe glass-crystalline substrate adjacent to the trenches may also beconverted to a ceramic phase; coating the one or more angled channelswith one or more metals; coating all or part of the inductor structurewith a dielectric media; removing all or part of the dielectric media toprovide electrical contact or free standing inductive device; andwherein the metal is connected to a circuitry through a surface orburied contact.

The inductive device stores current and functions as a current storagedevice. The one or more metals are designed to operate as an inductor atthe appropriate frequencies. The inductive device has a magneticpermeability greater than or equal to copper for frequencies greaterthan 100 MHz. The inductive device has a magnetic permeability greaterthan copper for frequencies less than 100 MHz. The ceramic phase can beetched from one side or both sides to partially or fully remove theglass-ceramic material. The method can further include the step ofconverting at least a portion of the glass into ceramic and etching awaythe ceramic to at least partially expose the metal structure. The methodcan further include the step of converting at least a portion of theglass into ceramic and etching away the ceramic to fully expose themetal structure.

The present invention also includes an inductive device having aglass-ceramic material surrounding one or more inductive coils whereinthe one or more inductive coils are at least partially surround by air.

The one or more inductive coils include one or more angled channels inthe glass-crystalline substrate with a metal coating over at least aportion of the one or more angled channels. The inductive element isfurther surrounded by a magnetically permeable material. The inductiveelement does not touch the magnetically permeable material. Theinductive element comprises a cavity filled with a magneticallypermeable material on one side, both sides or through the glass-ceramicmaterial. The one or more inductors interact with each other. The one ormore inductors share a magnetically permeable material. The metalcoating may reside partially through, fully through, or on top of theglass-ceramic material, or a combination there of. The inductive deviceof further includes 1 or more second metal layer on any surface.

The present invention also includes an inductive device having aglass-crystalline substrate surrounding one or more inductive coilswherein the one or more inductive coils are at least partially surroundby air. The inductive device includes one or more inductive coils arethat are supported by one or more rails on the glass-crystallinesubstrate. The inductive device includes one or more inductive coils arethat are positioned in one or more pits in the glass-crystallinesubstrate. The inductive device may include a metal coating, amultilayer metal coating, an alloy coating, a multilayer alloy coating.

BRIEF DESCRIPTION OF DRAWINGS

For a more complete understanding of the features and advantages of thepresent invention, reference is now made to the detailed description ofthe invention along with the accompanying figures and in which:

FIG. 1 shows a coreless transformer design.

FIG. 2 shows interlocking square spirals etched into APEX® glass.

FIG. 3A top view of an inductive device in/on APEX® glass.

FIG. 3B side view of an inductive device in/on APEX® glass.

FIG. 4A is an image of a free-standing copper RF antenna bridgestructure.

FIG. 4B is an image of a free-standing coil.

FIG. 5 is an image of a partially etched inductor, where the surroundingceramic has been partially etched away to allow mostly air to surroundthe inductive device.

FIG. 6 is an isometric image of a fully etched inductor, where thesurrounding ceramic has been fully etched away to allow only air tosurround the inductive device.

FIGS. 7A and 7B are side image of a fully etched inductor, where thesurrounding ceramic has been fully etched away to allow only air tosurround the inductive device.

DESCRIPTION OF INVENTION

While the making and using of various embodiments of the presentinvention are discussed in detail below, it should be appreciated thatthe present invention provides many applicable inventive concepts thatcan be embodied in a wide variety of specific contexts. The specificembodiments discussed herein are merely illustrative of specific ways tomake and use the invention and do not restrict the scope of theinvention.

To facilitate the understanding of this invention, a number of terms aredefined below. Terms defined herein have meanings as commonly understoodby a person of ordinary skill in the areas relevant to the presentinvention. Terms such as “a”, “an” and “the” are not intended to referto only a singular entity, but include the general class of which aspecific example may be used for illustration. The terminology herein isused to describe specific embodiments of the invention, but their usagedoes not delimit the invention, except as outlined in the claims.

FIG. 1 shows a coreless transformer design. FIG. 2 shows interlockingsquare spirals etched into APEX® glass. FIG. 3A top view of an inductivedevice in/on APEX® glass. FIG. 3B side view of an inductive device in/onAPEX® glass. FIG. 4A is an image of a free-standing copper RF antennabridge structure. FIG. 4B is an image of a free-standing coil. FIG. 5 isan image of a partially etched inductor, where the surrounding ceramichas been partially etched away to allow mostly air to surround theinductive device. FIG. 6 is an isometric image of a fully etchedinductor, where the surrounding ceramic has been fully etched away toallow only air to surround the inductive device. FIGS. 7A and 7B areside image of a fully etched inductor, where the surrounding ceramic hasbeen fully etched away to allow only air to surround the inductivedevice.

To address these needs, the present inventors developed a glass ceramic(APEX®) Glass ceramic) as a novel packaging and substrate material forsemiconductors, RF electronics, microwave electronics, and opticalimaging. APEX® Glass ceramic is processed using first generationsemiconductor equipment in a simple three step process and the finalmaterial can be fashioned into either glass, ceramic, or contain regionsof both glass and ceramic. The APEX® Glass ceramic possesses severalbenefits over current materials, including: easily fabricated highdensity vias, demonstrated microfluidic capability, micro-lens ormicro-lens array, high Young's modulus for stiffer packages, halogenfree manufacturing, and economical manufacturing. Photoetchable glasseshave several advantages for the fabrication of a wide variety ofmicrosystems components. Microstructures have been produced relativelyinexpensively with these glasses using conventional semiconductorprocessing equipment. In general, glasses have high temperaturestability, good mechanical and electrically properties, and have betterchemical resistance than plastics and many metals. To our knowledge, theonly commercially available photoetchable glass is FOTURAN®, made bySchott Corporation and imported into the U.S. only by Invenios Inc.FOTURAN® comprises a lithium-aluminum-silicate glass containing tracesof silver ions plus other trace elements specifically silicon oxide(SiO₂) of 75-85% by weight, lithium oxide (Li₂O) of 7-11% by weight,aluminum oxide (Al₂O₃) of 3-6% by weight, sodium oxide (Na₂O) of 1-2% byweight, 0.2-0.5% by weight antimonium trioxide (Sb₂O₃) or arsenic oxide(As₂O₃), silver oxide (Ag₂O) of 0.05-0.15% by weight, and cerium oxide(CeO₂) of 0.01-0.04% by weight. As used herein the terms “APEX® Glassceramic”, “APEX® glass” or simply “APEX®” is used to denote oneembodiment of the glass ceramic composition of the present invention.

When exposed to UV-light within the absorption band of cerium oxide thecerium oxide acts as sensitizers, absorbing a photon and losing anelectron that reduces neighboring silver oxide to form silver atoms,e.g.,

Ce³⁺+Ag⁺=Ce⁴⁺+Ag⁰

The silver atoms coalesce into silver nanoclusters during the bakingprocess and induce nucleation sites for crystallization of thesurrounding glass. If exposed to UV light through a mask, only theexposed regions of the glass will crystallize during subsequent heattreatment.

This heat treatment must be performed at a temperature near the glasstransformation temperature (e.g., greater than 465° C. in air forFOTURAN®). The crystalline phase is more soluble in etchants, such ashydrofluoric acid (HF), than the unexposed vitreous, amorphous regions.In particular, the crystalline regions of FOTURAN® are etched about 20times faster than the amorphous regions in 10% HF, enablingmicrostructures with wall slopes ratios of about 20:1 when the exposedregions are removed. See T. R. Dietrich et al., “Fabricationtechnologies for microsystems utilizing photoetchable glass,”Microelectronic Engineering 30, 497 (1996), which is incorporated hereinby reference. Preferably, the shaped glass structure contains at leastone or more, two or three-dimensional inductive device. The inductivedevice is formed by making a series of connected loops to form afree-standing inductor. The loops can be either rectangular, circular,elliptical, fractal or other shapes that create and pattern thatgenerates induction. The patterned regions of the APEX® glass can befilled with metal, alloys, composites, glass or other magnetic media, bya number of methods including plating or vapor phase deposition. Themagnetic permittivity of the media combined with the dimensions andnumber of structures (loops, turns or other inductive element) in thedevice provide the inductance of devices. Depending on the frequency ofoperation the inductive device design will require different magneticpermittivity materials. At low frequencies, less than 100 MHz devicescan use ferrites or other high different magnetic permittivitymaterials. At higher frequencies >100 MHz high different magneticpermittivity materials can generate eddy currents creating largeelectrical losses. So at higher frequency operations material such ascopper or other similar material is the media of choice for inductivedevices. Once the inductive device has been generated the supportingAPEX® glass can be left in place or removed to create a free-standingstructure. The present invention provides a single material approach forthe fabrication of optical microstructures withphoto-definable/photopatternable APEX® glass for use in imagingapplications by the shaped APEX® glass structures that are used forlenses and includes through-layer or in-layer designs.

Generally, glass ceramics materials have had limited success inmicrostructure formation plagued by performance, uniformity, usabilityby others and availability issues. Past glass-ceramic materials haveyield etch aspect-ratio of approximately 15:1 in contrast APEX®ß glasshas an average etch aspect ratio greater than 50:1. This allows users tocreate smaller and deeper features. Additionally, our manufacturingprocess enables product yields of greater than 90% (legacy glass yieldsare closer to 50%). Lastly, in legacy glass ceramics, approximately only30% of the glass is converted into the ceramic state, whereas with APEX™Glass ceramic this conversion is closer to 70%. APEX® compositionprovides three main mechanisms for its enhanced performance: (1) Thehigher amount of silver leads to the formation of smaller ceramiccrystals which are etched faster at the grain boundaries, (2) thedecrease in silica content (the main constituent etched by the HF acid)decreases the undesired etching of unexposed material, and (3) thehigher total weight percent of the alkali metals and boron oxideproduces a much more homogeneous glass during manufacturing.

The present invention includes a method for fabricating a glass ceramicstructure for use in forming inductive structures used inelectromagnetic transmission, transformers and filtering applications.The present invention includes an inductive structures created in themultiple planes of a glass-ceramic substrate, such process employing the(a) exposure to excitation energy such that the exposure occurs atvarious angles by either altering the orientation of the substrate or ofthe energy source, (b) a bake step and (c) an etch step. Angle sizes canbe either acute or obtuse. The curved and digital structures aredifficult, if not infeasible to create in most glass, ceramic or siliconsubstrates. The present invention has created the capability to createsuch structures in both the vertical as well as horizontal plane forglass-ceramic substrates. The present invention includes a method forfabricating of an inductive structure on or in a glass ceramic.Ceramicization of the glass is accomplished by exposing the entire glasssubstrate to approximately 20 J/cm² of 310 nm light. When tryingceramic, users expose all of the material, except where the glass is toremain glass. In one embodiment, the present invention provides aquartz/chrome mask containing a variety of concentric circles withdifferent diameters.

The present invention includes a method for fabricating an inductivedevice in or on glass ceramic structure electrical microwave and radiofrequency applications. The glass ceramic substrate may be aphotosensitive glass substrate having a wide number of compositionalvariations including but not limited to: 60-76 weight % silica; at least3 weight % K₂O with 6 weight %-16 weight % of a combination of K₂O andNa₂O; 0.003-1 weight % of at least one oxide selected from the groupconsisting of Ag₂O and Au₂O; 0.003-2 weight % Cu₂O; 0.75 weight %-7weight % B₂O₃, and 6-7 weight % Al₂O₃; with the combination of B₂O₃; andAl₂O₃ not exceeding 13 weight %; 8-15 weight % Li₂O; and 0.001-0.1weight % CeO₂. This and other varied compositions are generally referredto as the APEX® glass.

The exposed portion may be transformed into a crystalline material byheating the glass substrate to a temperature near the glasstransformation temperature. When etching the glass substrate in anetchant such as hydrofluoric acid, the anisotropic-etch ratio of theexposed portion to the unexposed portion is at least 30:1 when the glassis exposed to a broad spectrum mid-ultraviolet (about 308-312 nm) floodlamp to provide a shaped glass structure that have an aspect ratio of atleast 30:1, and to create an inductive structure. The mask for theexposure can be of a halftone mask that provides a continuous grey scaleto the exposure to form a curved structure for the creation of aninductive structure/device. A digital mask can also be used with theflood exposure and can be used to produce the creation of a inductivestructure/device. The exposed glass is then baked typically in atwo-step process. Temperature range heated between of 420° C.-520° C.for between 10 minutes to 2 hours, for the coalescing of silver ionsinto silver nanoparticles and temperature range heated between 520°C.-620° C. for between 10 minutes and 2 hours allowing the lithium oxideto form around the silver nanoparticles. The glass plate is then etched.The glass substrate is etched in an etchant, of HF solution, typically5% to 10% by volume, wherein the etch ratio of exposed portion to thatof the unexposed portion is at least 30:1 when exposed with a broadspectrum mid-ultraviolet flood light, and greater than 30:1 when exposedwith a laser, to provide a shaped glass structure with ananisotropic-etch ratio of at least 30:1.

Where the material surrounding the inductive device is converted toceramic before metal filling. Where the metallic material used to fillthe etched structures is metal other than copper (i.e. nickel, ironalloys). Where the surface of the inductive device is coated with adielectric material. Where the surface of the inductive device ispatterned first with a dielectric material and then with a patternedmetal.

For embodiments that are surrounded by the ceramic phase: Where theceramic is etched from one side or both sides to partially or fullyremove the glass-ceramic material to partially expose the metalstructures. An inductive device consisting of multiple unique inductivecomponents. Said device where different inductive components areselectively plated with different metals into different etched features.

1. A method to fabricate an inductive device created in or onphoto-definable glass comprising the steps of: preparing aphotosensitive glass substrate comprising at least silica, lithiumoxide, aluminum oxide, and cerium oxide; masking a design layoutcomprising one or more structures to form one or more electricalconduction paths on the photosensitive glass substrate; exposing atleast one portion of the photosensitive glass substrate to an activatingenergy source; exposing the photosensitive glass substrate to a heatingphase of at least ten minutes above its glass transition temperature;cooling the photosensitive glass substrate to transform at least part ofthe exposed glass to a crystalline material to form a glass-crystallinesubstrate; etching the glass-crystalline substrate with an etchantsolution to form the one or more angled channels in the device; whereinthe glass-crystalline substrate adjacent to the trenches may also beconverted to a ceramic phase; coating the one or more angled channelswith one or more metals; coating all or part of the inductor structurewith a dielectric media; removing all or part of the dielectric media toprovide electrical contact or free standing inductive device; andwherein the metal is connected to a circuitry through a surface orburied contact.
 2. The method of claim 1, wherein the inductive devicestores current and functions as a current storage device.
 3. The methodof claim 1, wherein the one or more metals are designed to operate as aninductor at the appropriate frequencies.
 4. The method of claim 3,wherein the inductive device has a magnetic permeability greater than orequal to copper for frequencies greater than 100 MHz.
 5. The method ofclaim 1, wherein the ceramic phase can be etched from one side or bothsides to partially or fully remove the glass-ceramic material.
 6. Themethod of claim 1, further comprising the step of converting at least aportion of the glass into ceramic and etching away the ceramic to atleast partially expose the metal structure or to fully expose the metalstructure.
 7. The inductive device made by the method of claim
 1. 8. Aninductive device comprising: a glass-ceramic material surrounding one ormore inductive coils wherein the one or more inductive coils are atleast partially surround by air.
 9. The inductive device of claim 8,wherein the one or more inductive coils comprise one or more angledchannels in the glass-crystalline substrate with a metal coating over atleast a portion of the one or more angled channels.
 10. The inductivedevice of claim 8, wherein the inductive element is further surroundedby a magnetically permeable material.
 11. The inductive device of claim10, wherein the inductive element does not touch contact themagnetically permeable material.
 12. The inductive device of claim 10,wherein the inductive element comprises a cavity filled with amagnetically permeable material on one side, both sides or through theglass-ceramic material.
 13. The inductive device of claim 10, whereinthe one or more inductors interact with each other.
 14. The inductivedevice of claim 10, wherein the one or more inductors share amagnetically permeable material.
 15. The inductive device of claim 9,wherein the metal coating may reside partially through, fully through,or on top of the glass-ceramic material, or a combination there of. 16.The inductive device of claim 9, further comprising 1 or more secondmetal layer.